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Some recent topics in gold plating for electronics applications

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Abstract

A review is presented of selected recent topics in electrolytic and electroless gold plating for electronics applications. The topics covered include developments of non-cyanide electroplating baths for plating soft gold suitable for fabricating microbumps on silicon wafers, electroplating of hard gold and alternative materials with thermally stable electrical contact resistance and wear resistance for use on connectors exposed to elevated temperatures, and neutral, non-cyanide electroless processes for plating pure, soft gold on isolated areas of circuit boards. The development of the new electroless processes has been a subject of great interest and activity, and therefore an extensive survey of the progress in this field is included.

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Authors and Affiliations

  1. Advanced Research Center for Science and Engineering, Waseda University, Tokyo, Japan

    Yutaka Okinaka

  2. Sanno Company, Ltd., Yokohama, Japan

    Masao Hoshino

Authors
  1. Yutaka Okinaka
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  2. Masao Hoshino
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Additional information

Yutaka Okinaka, a Fellow of the Electrochemical Society, is a former Distinguished Member of Technical Staff at AT&T Bell Laboratories, now Lucent Technologies, Murray Hill, New Jersey, USA. After retirement from Bell Labs in 1990, Dr Okinaka was a Visiting Professor at Waseda University, Tokyo, Japan until 1996, where he still actively directs research in the field of gold plating for electronics as a Visiting Research Fellow

Masao Hoshino is Director of Production Engineering, Sanno Co Ltd, Yokohama, Japan. As a major producer of connectors, IC sockets, and switches used in electronic products, the company is involved extensively in the plating of precious metals. Mr Hoshino is responsible for the production operation as well as for research and development in this area.

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Okinaka, Y., Hoshino, M. Some recent topics in gold plating for electronics applications. Gold Bull 31, 3–13 (1998). https://doi.org/10.1007/BF03215469

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