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Room Temperature Impact Consolidation (RTIC) of Fine Ceramic Powder by Aerosol Deposition Method and Applications to Microdevices

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Abstract

Ceramic integration technology requires downsizing and/or improvement of device performance in many applications, such as in the fabrication of microelectromechanical systems, display devises, fuel cells, optical devices, and RF components. For these applications, realization of high-speed deposition rate, low process temperature, and fine patterning in ceramic coating are very important. The aerosol deposition (AD) method has many advantages for above requirements in comparison with conventional thin-film method or thermal spray coating technology. In this article, advantages of the AD method are highlighted by realizing a comparison with conventional thin-film methods and thermal spray technology. Challenges associated with AD method are also highlighted. At the end, examples of integration of AD method in the fabrication of electronic components are also given to show the easiness in usage and in integration of this method in the device process flow.

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Acknowledgments

The author is very grateful to Dr. M. Lebedev, to his laboratory’s colleagues and to NEDO project members for their collaboration research. This research was supported in part by the NEDO Project on “Nanostructure Forming for Advanced Ceramic Integration Technology in Japan: Nanotechnology Program.”

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    Jun Akedo

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Akedo, J. Room Temperature Impact Consolidation (RTIC) of Fine Ceramic Powder by Aerosol Deposition Method and Applications to Microdevices. J Therm Spray Tech 17, 181–198 (2008). https://doi.org/10.1007/s11666-008-9163-7

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